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Accu rip printing lines in design4/1/2024 This technology uses two masks and a spacer deposition step to realize features on a wafer. The spacer-is-dielectric (SID) self-aligned double-patterning (SADP) process is a technology that can increase integration densities using today's process technologies. Unfortunately, these technologies are not ready for production as yet. As semiconductor manufacturing technologies move into the deep submicron era, the semiconductor industry is considering a number of new technologies, such as extreme ultraviolet (EUV) lithography and massively parallel electron beam lithography. BACKGROUNDÄramatic improvements in semiconductor integration densities have largely been achieved through corresponding improvements in semiconductor manufacturing technologies. More specifically, this disclosure relates to systems and techniques for determining mask layouts for a spacer-is-dielectric self-aligned double-patterning process. This disclosure relates to electronic design automation (EDA).
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